Gap Filler
Gap Filler 2000
Features & Benefits
- Thermal conductivity: 2.0 W/m-K
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
- 100% Solids – no cure by-products
- Excellent low and high temperature mechanical and chemical stability
Properties
| Properties | Imperial Value | Metric Value | Test Method |
|---|---|---|---|
| Color / Part A | Pink | Pink | Visual |
| Color / Part B | White | White | |
| Viscosity as Mixed (cps)(1) | 300,000 | 300,000 | ASTM D2196 |
| Density (g/cc) | 2.9 | 2.9 | ASTM D792 |
| Mix Ratio | 1:1 | 1:1 | |
| Shelf Life @ 25°C (months) | 6 | 6 | ASTM D792 |
| PROPERTY AS CURED | |||
|---|---|---|---|
| Cplor | Pink | >Pink | Visual |
| >Hardness (Shore 00)(2) | 70 | 70 | ASTM D2240 |
| >Heat Capacity (J/g-K) | 1.0 | 1.0 | ASTM D1269 |
| Continuous Use Temp (°F) / (°C) | -76 to 392 | -60 to 200 |
| ELECTRICAL AS CURED | |||
|---|---|---|---|
| Dielectric Strength (V/mil) | 500 | 500 | ASTM D149 |
| Dielectric Constant (1000 Hz) | 7 | 7 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | 10" | 10" | ASTM D257 |
| Flame Rating | V-O | V-O | U.L. 947 |
| THERMAL AS CURED | |||||
|---|---|---|---|---|---|
| Thermal Conductivity (W/m-K) | 2.0 | 2.0 | ASTM D5470 |
| CURE SCHEDULE | |||||
|---|---|---|---|---|---|
| Pot Life @ 25°C (3) | 15min | 60 min | 600 min (10 hr) | ||
| Cure @ 25°C(4) | 1-2 hours | 3-4 hours | 3 days | ||
| Cure @ 100°C (4) | 5 min | 15 min | 1 hour |