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HI FLOW Hi-Flow 625 Features & Benefits Thermal impedance: 0.71°C-in2/W (@25 psi) Electrically isolating 65°C phase change compound coated on … Continue ReadingHi-Flow 625

HI FLOW Hi-Flow 565UT Features & Benefits  Thermal impedance: 0.05°C-in2/W (@25 psi)  High thermal conductivity: 3.0 W/mK  Phase change softening … Continue ReadingHi-Flow 565UT

ADHESIVES Liqui-Bond SA 3505 Features & Benefits Thermal Conductivity: 3.5 W/m-K Eliminates need for mechanical fasteners Room Temperature Storage Maintains … Continue ReadingLiqui-Bond SA 3505

ADHESIVES Liqui-Bond SA 2000 (one-part) Features & Benefits  High thermal conductivity: 2.0 W/m-k  Eliminates need for mechanical fasteners  One-part formulation … Continue ReadingLiqui-Bond SA 2000​

HI FLOW Hi-Flow 300P Features & Benefits Thermal impedance: 0.13°C-in2/W (@25 psi)  Field-proven polyimide film  -excellent dielectric performance  -excellent cut-through … Continue ReadingHi-Flow 300P

ADHESIVES Liqui-Bond SA 1800 (one-part) Features & Benefits High thermal conductivity: 1.8W/m-K Eliminates need for mechanical fasteners Low viscosity for … Continue ReadingLiqui-Bond SA 1800 (one-part)

HI FLOW Hi-Flow 225UT Features & Benefits Thermal impedance: 0.08°C-in2/W (@25 psi) 55°C phase change composite with inherent tack characteristics … Continue ReadingHi-Flow 225UT

ADHESIVES Liqui-Bond SA 1000 (one-part) Features & Benefits  High thermal performance  Eliminates need for mechanical fasteners  Low viscosity for ease … Continue ReadingLiqui-Bond SA 1000

ADHESIVES Liqui-Bond EA 1805 Features & Benefits  Room temperature cure  Room temperature storage  Thermal Conductivity: 1.8 W/m-K  Eliminates need for … Continue ReadingLiqui-Bond EA 1805

ADHESIVES Bond-Ply LMS-HD Features & Benefits  TO-220 Thermal performances: 2.3°C/W, initial pressure only lamination  Exceptional dielectric strength  Very low interfacial … Continue ReadingBond-Ply LMS-HD